Product function
3D SPI (Solder Paste Inspection) Solder paste inspection machine is a high-precision optical inspection system used to detect solder paste deposits on the circuit board. Features on the circuit board can be detected quickly and reliably. The latter adjusts the assembly position according to the actual solder paste printing situation.
Able to identify defects and detect with high precision. These features make the 3D SPI solder paste tester a key device for ensuring welding quality, improving production efficiency and reducing defect rates.
Technical Parameters
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Technical specifications |
|
|
Detection object |
Volume, height, XY offset, area |
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Height measurement range |
0~450μm |
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High Repetition Accuracy |
±1% (3σ) |
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volume Repetition Accuracy |
±1% (3σ) |
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Height measurement accuracy |
2μm |
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Maximum PCB warpage |
5mm |
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substrate processing capacity |
0.4mm~7mm |
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Power Supply |
AC380V 50HZ |
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Body size |
3400(L)*1400(W)*1700(H)mm |
|
weight |
1180KG |
Advantage description
1.With three-dimensional compensation function, measure the bending difference occurred against the datum plane for real-time compensation.
2.Bi-directional projection system, effectively eliminating shadows
3.Easier programming and debugging, import Gerber to automatically generate detection program
4.The interface structure of the operating system is optimized according to the userlevel, which improves the verification and processing functions of detection results
Applicable scene
Solder paste detection for mainboard, mobile phone, FPC board, BGA, pin IC, 0201 and 01005components.
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