Your Professional SMT Reflow Soldering Machine Supplier

 

Guangdong MOJE Intelligent Equipment Co., Ltd. is located in Huangpu Economic and Technological Development Zone, Guangzhou City, Guangdong Province. It is a high-tech enterprise specializing in the research and development, manufacturing, and sales of SMT multifunctional surface mount machines and printing machines, reflow soldering, AOI and other SMT assembly lines. We are committed to becoming a leading provider of intelligent high-precision mounting solutions in China.

Why Choose Us

Professional Team

We Professional scientific research team, 10 years of research and development. One-stop SMT whole line solution.

Sales Market

Our sales markets include Vietnam, India, Pakistan, Saudi Arabia, Egypt, Iran, Mexico.

Advanced technology

Company Nearly 100 intellectual property technologies synchronized with the international advanced level. Independent research and development, design, meet the demand of customization.

Quality Assurance

Our company has High precision, high economical ,high stability and efficiency. Dualarm and dual-drive control system, adopts linear motor control for more stability and accuracy.

 

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    The online AOI (Automated Optical Inspection) machine is an automated optical inspection device specifically designed for SMT (Surface-Mount Technology) production lines
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  • Off-line Automated Optical Inspection AOI
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  • 12 Zone Lead Free Reflow
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  • 3D SPI Solder Paste Inspection Machine
    3D SPI (Solder Paste Inspection) Solder paste inspection machine is a high-precision optical inspection system used to detect solder paste deposits on the circuit board. Features on the circuit board
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  • SMT PCB Loader
    PCB loading machine is an automation equipment widely used in the field of electronics manufacturing, mainly used to automatically send PCB board to the production line to improve production
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  • SMT PCB Unloader
    This PCB loading machine features a special aluminum alloy structure and an auxiliary positioning brake system for rapid and precise positioning, enhancing production efficiency. Its PLC control and
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  • SMT Docking Station
    Modular Design**: The equipment features a modular structure, allowing for customizable assembly and disassembly based on customer needs.
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Types of SMT Reflow Soldering Machine

Infrared Reflow Machine

Infrared (IR) reflow Machine use infrared radiation to heat the PCBs. This method quickly ramps up the temperature, providing a fast and direct heating process.

Convection Reflow Machine

Convection reflow Machine use heated air to uniformly distribute heat across the PCB. This method is widely used due to its effectiveness in providing even heating and better control over temperature profiles.

Vapor Phase Reflow Machine

Vapor phase reflow Machine utilize a heat transfer fluid that vaporizes at a specific temperature, ensuring consistent and precise heat application to the PCB.

 

Features of SMT Reflow Soldering Machine

 

Dimension 4900*1270*1450(mm)
Starting total power 45KW, Normal: 8KW
Controlled temperature zones Up 8 heating Zones, down 8 heating zones, 2 cooling zone
Heating length 3000MM
Temp. Accuracy ±1℃
Temp. Accuracy ±2℃
Heat up time <25min
Mesh speed 0-1.8M/MIN
Mesh height 900±20mm
Mesh width 480 mm
Mode of transport Mesh belt
PCB Size 50~350 mm, can be adjustable
Apply solder paste type Lead-free solder/Ordinary solder;
Applicable components type BGA,CSP etc. single/double sided;
Power protect UPS;
Control Method Full computer control;
Screw Furnace electric screw
Weight 1800KG

 

 

Parameters Of Smt Reflow Soldering Machine

 

Use solder paste type

Lead-free solder/ordinary solder

Suitable for element types

BGA, CSP, single/double panel, etc

Heating area

Upper and down 8 heating zones, and 2 cooling zones

Heating zone length

3100 mm

Temperature control mode

PC + PLC control

Temperature control precision

+ / - 1 ℃

The temperature control range

Room temperature to 350 ℃

PCB transverse temperature deviation

< ±2℃

The heating time

Approx 20 min

Transport transmission

Network chain transmission + guide rail

Chain guide the wide range

From 20 to 300 mm

Network belt width

400 mm

The transmission speed

25 ~ 2000mm/min

PCB transport direction

Left to right (right to left) optional

Power supply

3 phase , 380 v, 50 hz

Start power

32 kw

Normal work power

7 kw

Transport wind way

All hot air

Net weight

1600 kg

The machine size

L4400*H1450*W900mm

 

Applications of SMT Reflow Soldering Machine

 

 

Reflow soldering machines are suitable for mass-produced electronics manufacturing industries, especially for products that require mass production and require high soldering quality. The reflow soldering machine has the advantages of fast welding speed, high efficiency, and low cost, which can greatly improve production efficiency and reduce production costs. In addition, the reflow soldering machine can also solder some complex circuit boards and components, such as multi-layer PCB boards, IC chips, etc.

Temperature Requirements for SMT Reflow Soldering Machine
 

With Sn/Pb solders, the melting point temperature typically peaks around 215°C to 245°Cwith around 20-60 seconds above 183 degrees.

 

For lead-free soldering, the reflow temperature should reach 260°C.

 

The typical reflow soldering oven has different temperature zones and the temperature occasionally increases according to a pre-set curve that has to be adjusted as per the assembly aspects and temperature requirements.

SMT PCB Loader
 

Specification of SMT Reflow Soldering Machine

 

Product name

SMT Reflow Soldering Machine

Heating Zone Quantity

Upper6 / Down6

Cooling Fan

Upper4

Conveyor Speed

50~600 mm/min

Temperature Range

Room temperature~300℃

Temperature Accuracy

1℃

PCB Temperature Deviation

±2℃

Max soldering height(mm)

35mm (includes PCB thickness)

Max Soldering Width (PCB Width)

350mm

Length Process Chamber

1354mm

Electricity Supply

AC 220v/single phase

Machine Size

L2305mm×W612mm×H1230mm

Heat-up Time

30 min

 

FAQ

Q: What is the purpose of reflow soldering?

A: The goal of the reflow process is for the solder paste to reach the eutectic temperature at which the particular solder alloy undergoes a phase change to a liquid or molten state. At this specific temperature range, the molten alloy demonstrates properties of adhesion.

Q: What is the difference between soldering and reflow soldering?

A: Reflow soldering uses hot air, while wave soldering uses a 'wave' of solder to mass-produce PCBs. This means that the internal environment in a wave solder oven is far more sensitive—a small change in temperature or conditions might result in catastrophic damage to the PCBs.

Q: What is SMT process?

A: Surface mount technology (SMT) is the process wherein components are mounted onto the surface of a printed circuit board. The components are designed specifically to be directly mounted, rather than hardwired, onto the circuit board for the vast majority of electronics.

Q: How many times can you reflow solder?

A: I would "suggest" no more than two heating cycles, to solder reflow temperature. Most assemblies can be soldered in one pass through reflow or wave soldering. Some require two, if components are applied to both sides and you do not wish to "glue" the parts on the bottom side.

Q: Do I need flux to reflow solder?

A: Additionally, certain types of soldering, such as surface-mount soldering or reflow soldering, practically demand flux usage due to the precision required. If you're working on boards one by one, using flux can help enhance your soldering accuracy and result in more durable and reliable circuits.

Q: How do I choose solder thickness?

A: For most electronic work, choose a thinner diameter solder wire ranging from 0.015 inches to 0.062 inches. The best approach is to match the diameter to the size of the connectors or components that you want to solder and that the size works with your soldering iron tip.

Q: How many zones are in reflow?

A: Profile characteristics. The standard reflow profile has four zones: preheat, soak, reflow and cooling. The profile describes the ideal temperature curve of the top layer of the PCB. The preheating zone should increase the temperature at a maximum rate of 3 °C/s.

Q: What is the best reflow temperature?

A: Between 235°C and 250°C
Reflow Zone: The reflow zone is where the peak temperature is reached, causing the solder paste to melt and form a strong metallurgical bond between the component leads and the PCB pads. The peak temperature typically ranges between 235°C and 250°C, depending on the solder paste used.

We're professional SMT reflow soldering machine manufacturers and suppliers in China, providing high quality customized service with low price. Be free to buy cheap SMT reflow soldering machine in stock here from our factory. For quotation, contact us now.

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