Overview Of Chip Mounting Machine

In order to win a place in today's fierce market competition, electronic product manufacturers must constantly find a way to reduce product costs and product introduction time, while at the same time continuously improving the quality of new products. In addition to improving production processes and procedures, electronic product manufacturers must also encourage semiconductor device manufacturers to incorporate more functions into miniaturized programmable integrated circuits (PICs). Therefore, for the design and manufacture of high-end electronic products, a path of smaller size, stronger functions and lower prices is clearly presented to us. In this context, today's programmable integrated circuits have many pins, strong functions, and innovative assembly forms. However, electronic product manufacturers who want to use the latest PIC devices must overcome some problems encountered during programming. Simply put, in order to successfully program PCI devices, you need to learn some new methods. Fu Haoyun provides technical support for mainland JUKI placement machines.
Industry Background
For PIC devices, DIP, PLCC or SOIC packaging was generally used in the past. However, with the increasing demand for compact and high-performance products, more advanced PIC devices are required. Flash memory devices are available in SOP, TSOP, VSOP, BGA and micro-BGA packages. High-performance microcontrollers, CPLDs and FPGAs are available in QFP, BGA and micro-BGA packages with pin counts ranging from 44 to over 800.
Due to the high pin count and small form factor, most of these components are only available in fine pitch packages. Fine pitch components have very fragile pins with a spacing of only 0.508mm (20 mils) or almost no clearance. This has led to the use of PIC devices to meet this challenge. PIC devices with high density and high performance are expensive and require high-quality programming equipment and excellent process control to minimize component scrap.
Fine pitch components are virtually certain to encounter threats from coplanarity and other forms of pin damage during manual programming. If the pins are damaged, it may cause problems with the reliability of the solder joints, which will increase the defect rate in the manufacturing process. Similarly, high-density components will actually take longer to program, which will reduce production efficiency.
Programming on the circuit board
Users of advanced PIC devices face a difficult choice: risk quality problems and use manual programming? Or find an alternative programming method that eliminates the manual touch method?
To achieve the latter, manufacturers initially began to use on-board programming (OBP). OBP is a simple method that programs the PIC after it is mounted on a printed circuit board (PCB). Generally, testing or functional testing is performed on the circuit board. Flash memory, Electrically Erasable ProgrammableRead-Only Memory (EEprom), EEprom-based CPLD devices, EEprom-based FPGA devices, and microcontrollers with built-in flash memory or EEprom are all programmed in OBP form.
The most common method for implementing OBP to meet the requirements of flash memory and microcontrollers is to use automatic test equipment (ATE) programming with the help of a bed-of-nails fixture. Logic devices are complex to program and are not suitable for ATE bed-of-nails programming.
A new OBP technology based on the original IEEE specification to support testing shows a promising future. The specification, called IEEE 1149.1, specifies a series of boundary scan protocols that have been used in many PIC programming methods.
If electronic product manufacturers want to use IEEE 1149.1 programming methods, they rely on intellectual property protection tools provided by various semiconductor manufacturers. But programming with their tools is very slow. Also, because of their instinct to protect intellectual property, each tool is limited to the device used by a single user. This is a major drawback if the PIC devices on a circuit board are used by multiple users.
In summary, using OBP methods can eliminate the phenomenon of manual device handling and programming into testing, as well as slow manufacturing production. However, the time required for programming can also be slow.
ATE Pin-on-disk programming
ATE equipment was originally used to perform in-circuit testing of PCB assemblies to detect defects such as open and short traces, missing components, and misaligned components that occur during the manufacturing process. Pin-on-disk fixtures are array-configured, spring-loaded test terminals that form a mechanical and electrical interface between the PCB and the signal-driving circuitry of the ATE test equipment.
Once the PCB is securely connected to the pin-on-disk fixture, the signal-driving circuitry of the ATE test equipment will send programming signals to the target device PIC through the pin-on-disk fixture and the PCB. In addition to testing for mechanical defects, ATE equipment can also be used to program PIC devices. The programming and erasure procedures for components are embedded in the circuit board test procedure to program the target device.
IEEE 1149.1 Boundary Scan Programming
In order to increase the density and complexity of PCB assemblies, the testing of circuit boards and components faces great difficulties, especially for PCB assemblies with limited space. In order to effectively solve this problem, a boundary scan test protocol (IEEE 1149.1) came into being.
The IEEE 1149.1 test standard can program logic devices or flash memory devices on assembled circuit boards through an intelligent external device. This programming device forms a connection interface with the circuit board through a standard test access port (Test Access Port, abbreviated as TAP). All of this requires the use of JTAG hardware control devices, JTAG software systems, JTAG-compatible PCB circuit boards, and a four-wire test access port.
Boundary scan work can be implemented using a specialized dedicated circuit board programming device, or another option is to use some tools provided by companies such as GenRad, Hewlett-Packard and Teradyne ATE testers in the United States, so that IEEE 1149.1 boundary scan programming can be implemented on ATE test equipment.
One of the biggest advantages of using the IEEE standard is that it can program a variety of components provided by different suppliers on the same PCB. This can reduce the overall programming time and simplify the manufacturing process.
Automated Programming (AP) Equipment
PIC technology continues to advance, so new automated programming equipment and technology keep pace. For example, Data I/O's ProMaster 970 automated fine pitch programming equipment can program PIC devices in advanced package formats, including BGA, micro BGA, SOP, VSOP, TSOP, PLCC, SON and CSP. Dual pick-and-place (PNP) headers and optional 8, 10 or 12-pin sockets can maximize the efficiency of the equipment. The programming equipment can also further involve quality control of the device. For example, coplanarity issues and pin damage are virtually non-existent because the integrated laser vision system can ensure very accurate device placement.
Automated cluster programming can generally be 5 to 10 times faster than ATE programming due to the variety of programming interfaces and PNP device configurations. Again, these programming tools are designed specifically for programming, not for testing boards or functions, so they can provide very good programming quality.
Fine-pitch PIC devices can be very expensive, so if the damage rate during the manufacturing process can be reduced, it will greatly improve the manufacturer's break-even point. Automatic programming systems that can be applied to most components are also very flexible and can be adapted to advanced packaging device forms. The combination of high productivity, high quality and flexibility has resulted in the lowest available programming price per device often being less than 20% of the ATE programming price.